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乐泰 ABLESTIK 969-1 preimidized polyimide adhesive isdesigned for semiconductor die attach.
It may be cured in onestep at or below 200oC. This product is not recommended foruse in hermetic packages.
TYPICAL PROPERTIES OF UNCURED MATERIALViscosity, Brookfield CP51, 25 °C, mPa•s (cap):Speed 5 rpm 15,000Work Life (1% change in silver content), hours 12Shelf Life @ -40°C (from date of manufacture), days 365Flash Point - See SDSTYPICAL CURING PERFORMANCE Cure Schedule1 hour @ 200°CAlternate Cure Schedule2 hours @ 180°CThe above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties Coefficient of Thermal Expansion :Below Tag, pap/°C 25Glass Transition Temperature (Tag) by TMA, °C 236Extractable Ionic Content, @ 100°C ppm:Chloride (Co-) 2Sodium (Na+) 10Potassium (K+) <1Weight Loss @ 300oC, TGA, % 0.4StorageStore product in the unopened container in a dry location. Storage information may be indicated on the product container labeling. Optimal Storage: -40 °C. Storage below minus (-)40 °C or greater than minus (-)40 °C can adversely affect product properties.
Material removed from containers may be contaminated during use.
乐泰 ABLESTIK 969-1
预聚酰亚胺粘合剂用于半导体芯片附着。
它可以在200oC或更低温度下固化。本产品不推荐用于密封包装。
固化材料的典型性能粘度，Brookfield CP51,25℃，map’s（cap）：速度5 rpm 15,000工作寿命（银含量变化1％），小时12Shelf寿命@ -40°C（从制造日期起）天365Flash点 - 请参阅SDSTYPICAL CURING PERFORMANCECURE Schedule 1小时@ 200°CAlternate治疗计划2小时@ 180°CTh |
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