ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/ECCOBOND DX-20C电子组装/工业胶水/电子组装胶水/工业用胶
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ECCOBOND DX-20C dielectric adhesive offersexcellent adhesion strength, especially at wirebonding process temperature to minimize defect rateat assembly. It features strong heat / UV resistance andcan be applied by pin transfer, stamping and dispensing.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Cone & Plate, mPa•s (cP):
@ 25°C Speed 10 rpm 12,000
Specific Gravity 1.17
Work Life @ 25°C, days 5
Shelf Life @ -20°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 170°C
Time shown does not include ramp-up time to cure temperaure.
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary
based on customers' experience and their applicationrequirements, as well as customer curing equipment,
oven loading and actual oven temperatures.
Storage Store product in the unopened container in a drylocation. Storage information may be indicated on the productcontainer labeling.Optimal Storage: -20 °C
ECCOBOND DX-20C电介质粘合剂优异的粘合强度，特别是在线材接合工艺温度以*小化缺陷率在装配。它具有强烈的耐热/耐紫外线性能可以通过销转印，冲压和分配来应用。
固化材料的典型特性
粘度，圆锥和平板，mPa•s（cP）：
@ 25°C速度10 rpm 12,000
比重1.17
工作生活@ 25°C，第5天
保质期@ -20°C，月6
闪点 - 参见MSDS
典型的固化性能
治愈时间表
1小时@ 170°C
显示的时间不包括加温时间来治愈温度。
以上治疗方案是指导性建议。治愈条件（时间和温度）可能会有 |
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