汉高汉高乐泰乐泰 UF 3808
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乐泰 ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 20 s
-1
, Cone and Plate, mPa∙s (cP) 360
Specific Gravity, 1.16
Pot life @ 25°C, 25% viscosity increase, days 3
Shelf Life @ -20°C, days 365
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
≥8 minutes @ 130°C
Alternative Curing Conditions
5 minutes @ 150°C
The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customer |
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