ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/工业胶水/电子组装胶水/工业用胶
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ECCOBOND TE3530 adhesive is designed for bonding heat dissipation components and can be applied by automatic syringe dispense.
TYPICAL PROPERTIES OF UNCURED MATERIALViscosity @ 25 °C, mPa∙s (cap):@ 10 s-1 60,000Specific Gravity 2.6 to 2.85Hegman Fineness, micron 40Shelf Life:@ -25 to -18oC, months 6@ 18 to 25oC, days 3Flash Point - See MSDSTYPICAL CURING PERFORMANCE Cure Schedule30 minutes @ 100°C or15 minutes @ 120°C or10 minutes @ 150°CNOTE: Cure can be accelerated by using IR cure instead of convection oven curette above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based noncustomers’' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Coefficient of Thermal Expansion , K-1 36×10-6Glass Transition Temperature (Tag) ,DMA, °C55Thermal Conductivity, W/mk 2.3StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.Optimal Storage: -25 to -18 °C.
ECCOBOND TE3530粘合剂设计用于粘合散热部件，可通过自动注射器分配应用。
25℃，mPa∙s（cap）下的固化材料的特性：@ 10 s-1 60,000特殊重力2.6至2.85Hegman细度，微米40Shelf寿命：@ -25至-18oC，月6日18至25oC，第3天闪点 - 参见MSDSTYPICAL CURING PERFORMANCECURE Schedule在100°C或30分钟，在120°C或15分钟，150°C或10分钟@ 150°CNOTE：可以通过使用红外固化加快固化，而不是对流固化上述固化曲线是指导性建议。保养条件（时间和温度）可能会根据客户的经验和应用要求以及客 |
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