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技术服务热线：021-51693135 / 021-22818476
PRODUCT DESCRIPTION
Hysol® FP4450 is high purity, low stress liquid encapsulantwith good moisture resistance and an extended working life. Itis designed for protection of bare semiconductor devices.Pressure pot performance on live devices is up to 500 hourswith no failures, depending upon device and package type.
This material is designed for temperature cycling ranges up to
-65°C to 150°C. Pot life or working life has been extended to
approximately 3 days. This liquid epoxy exhibits relatively high
flow. A cavity or a potting dam is required for flow control.
Hysol® FP4450 may be suitable for bare chip protection in a
variety of advanced packages such as IC memory cards, chip
carriers, hybrid circuits, chip-on-board, multi-chip modules, ball
grid arrays and pin grid arrays. The high temperature
performance and excellent resistance to chemicals, moisture
and handling damage, are also advantageous for automotive
applications.
Extractable Ionic Content (ITM107B)
Chloride (Cl-), ppm 5
Sodium (Na+), ppm 1
Potassium (K+), ppm 2
Handling
Pot Life @ 25°C, 77°F, days, 3
(200 gram mass ),(ITM10T),
Gel Time @ 121°C, (250°F), minutes 12
产品描述
Hysol®FP4450是高纯度，低应力液体密封剂
具有良好的耐湿性和延长的使用寿命。它
被设计用于保护裸半导体器件。
现场设备的压力罐性能可达500小时
没有故障，取决于设备和包装类型。
该材料专为温度循环范围而设计
-65℃至150℃。使用寿命或工作寿命延长至
约3天。该液体环氧树脂显示较高
流。流量控制需要一个空腔或灌封坝。
Hysol®FP4450可能适用 |
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