ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/ECCOBOND TE3530电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
ECCOBOND TE3530 adhesive is designed for bonding heatdissipation components and can be applied by automaticsyringe dispense.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP):
@ 10 s
-1 60,000
Specific Gravity 2.6 to 2.85
Hegman Fineness, micron 40
Shelf Life:
@ -25 to -18oC, months 6
@ 18 to 25oC, days 3
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
30 minutes @ 100°C or
15 minutes @ 120°C or
10 minutes @ 150°C
NOTE: Cure can be accelerated by using IR cure instead of convectionoven cure
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -25 to -18 °C
ECCOBOND TE3530粘合剂专为粘合热而设计耗散元件，可自动应用注射器分配
固化材料的典型特性
25℃下的粘度，mPa•s（cP）：
@ 10秒
-1 60,000
比重2.6〜2.85
赫格曼细度，微米40
保质期：
@ -25至-18℃，月6日
@ 18至25oC，第3天
闪点 - 参见MSDS
典型的固化性能
治愈时间表
在100°C或30分钟
在120°C或15分钟
150°C 10分钟
注意：通过使用红外固化而不是对流可以加 |
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