ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/ECCOBOND G757HF电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
G757HF photocurable adhesive is designed for highthroughput assembly operations.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Density , g/cm3 1.15
Sag Resistance (45o angle), mm:
@ 25oC 1.88
@ 150oC 3.1
Shelf Life @ 0°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
45 minutes @ 140°C
20 minutes @ 160°C or
10 minutes @ 180°C or
Post Cure
2 to 4 hours at the highest expected use temperature
This product generates high heat during cure. No adverse exothermeffects are obtained when cured in bond thicknesses less than orabout 0.125 inches (3.2 mm).The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures.
Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: 0°C. Storage greater than or below 0°Ccan adversely affect product properties.
G757HF可光固化粘合剂专为高吞吐量组装操作。
固化材料的典型特性
密度，g /cm31.15
阻力（45o角），mm：
@25oC1.88
@150oC3.1
保质期0°C，月6
闪点 - 参见MSDS
典型的固化性能
治愈时间表
在140°C 45分钟
在160°C或20分钟
180°C或10分钟
后治
在*高预期使用温度下2至4小时本产品在固化过程中产生高热量。没有不利的放热当焊接厚度小于或等于或小于固化时，可获得效果约0.125英寸（3.2mm）。以上治疗方案是准则建议。治愈条件（时间和温度）可能会根据客户的经验及其应用要求，以及客户固化设备， |
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