ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/ECCOBOND DX-10C电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
ECCOBOND DX-10C is a thermosetting, dielectricadhesive developed for GaN blue and white LED chip bonding. It features strong heat / UV resistance and can be applied bypin transfer, stamping and dispensing.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP):
Speed 10 rpm 3,000
Work Life, hours 4
Shelf Life @ -20°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
1 hour @ 140°C
Time shown does not include ramp-up time to cure temperaure.The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures.
Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -20 °C
ECCOBOND DX-10C是一种热固性电介质粘合剂开发用于GaN蓝色和白色LED芯片接合。它具有强的耐热/耐紫外线性，可以应用针转印，冲压和分配。
固化材料的典型特性
25℃下的粘度，mPa•s（cP）：
速度10 rpm 3,000
工作时间4小时
保质期@ -20°C，月6
闪点 - 参见MSDS
典型的固化性能
治愈时间表
1小时@ 140°C
显示的时间不包括加温时间来治愈温度。以上治疗方案是指导性建议。治愈条件（时间和温度）可能会有所不同客户的经验和应用要求以及客户固化设备，烤箱装载和实际烘箱温度。
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