ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/ECCOBOND 59C电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
乐泰 ABLESTIK 59C adhesive is designed for applications usedat high temperatures which require electrical conductivtiy and do notneed a high bond strength. It can be used in its cured or uncured state.
乐泰 ABLESTIK 59C can be used with a variety of catalysts. Formore information on mixed properties when used with other availablecatalysts, please contact your local technical service representative for
assistance and recommendations.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Density , g/cm3 2.4
Shelf Life @ 25°C, months 6
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
6 hours @ 150°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures.
Storage Store in original, tightly covered containers in clean, dry areas.Storage information may be indicated on the product containerlabeling.Optimal Storage: 25°C. Storage below 25°C or greater than 25°Ccan adversely affect product properties.
乐泰 ABLESTIK 59C胶粘剂专为使用的应用而设计在高温下需要电导和不要需要高粘结强度。它可用于其固化或未固化状态。乐泰 ABLESTIK 59C可与各种催化剂一起使用。对于有关混合属性的更多信息与其他可用时使用催化剂，请联系您当地的技术服务代表协助和建议。
固化材料的典型特性
密度，g /cm32.4
保质期25°C，月6
闪点 - 见SDS
典型的固化性能
治愈时间表
在150°C下6小时
以上治疗方案是指 |
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