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乐泰 ABLESTIK 84-1A adhesive is designed for highvolume semiconductor packaging applications. This adhesiveis ideal for application by printing, dispensing or stamping.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield CP51, 25 °C, mPa•s (cP):
Speed 5 rpm 18,000
Work Life @ 25°C, weeks 2
Shelf Life @ -40°C (from date of manufacture), days 365
TYPICAL CURING PERFORMANCE
Cure Schedule
10 minutes @ 180°C
Alternative Cure Schedule
6 minutes @ 200°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures
Storage
Store product in the unopened container in a dry location. Storageinformation may be indicated on the product container labeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C or greaterthan minus (-)40 °C can adversely affect product properties. 乐泰 ABLESTIK 84-1A胶粘剂专为高体积半导体封装应用。这种粘合剂是通过印刷，分配或冲压应用的理想选择。
固化材料的典型特性
粘度，Brookfield CP51,25℃，mPa•s（cP）：
速度5 rpm 18,000
工作生活@ 25°C，第2周
保质期@ -40°C（制造日期），第365天
典型的固化性能
治愈时间表
180°C 10分钟
替代治疗计划
在200°C下6分钟
以上治疗方案是指导性建议。 |
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