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SI 5404™ is designed to bond metallic heat sinks, ceramicchips and circuit board substrates.
SI 5404™ applicationsinclude the bonding of various heat generating devices (powerdevices) to their respective heat sinks.
The adhesive isdesigned to provide a strong bond between the device and itsheat sink as well as low resistance to the flow of heat from theelectronic device to the heat sink.
This will help maintain aconsistent dispersion of the conductive filler within the adhesivematrix.Suggested minimum heat cure conditions for either IR or convectionoven: 10 minutes at 150°C or 15 minutes at 130°C.
All times givenabove are exclusive of heat up rate. It is essential that the bond linesattain these temperatures for the stated times.
Cure rate is verydependent on the oven type used, the size and geometry of the partsbeing bonded as well as their composition.
StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.Optimal Storage: 2 °C to 8 °C.
Storage below 2 °C orgreater than 8 °C can adversely affect product properties.
SI 5404™设计用于粘接金属散热器，陶瓷芯片和电路板基板。
SI 5404™应用包括将各种发热设备（电力设备）连接到各自的散热器。
粘合剂被设计成在装置和其热槽之间提供牢固的结合，以及对从电子 |
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