乐泰 3523电子组装/工乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/乐泰 3523电子组装/业胶水/电子组装胶水/工业用胶
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乐泰 3523 is used to bond, seal or coat metal sandglass components in industrial applications.
This product is suitable for reinforcement of flexible PCB and for bonding aide range of materials.
When cured, it offers excellent flexibility and toughness, making it highly resistant to vibration and impact forces. TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.06Refractive Index, ASTM D 1218 1.48Flash Point - See MSDSViscosity, Brookfield - RVF, 25 °C, mPa•s (cP):Spindle 6, speed 20 rpm 16,000 to 24,000LMSTYPICAL CURING PERFORMANCE乐泰 3523 cures when exposed to UV radiation of 365nm. To obtain full cure on surfaces exposed to air, radiation @220 to 260 nm is also required.
The speed of cure and depth of cure will depend upon the UV intensity and spectral distribution of the light source, the exposure time and the light transmittance of the substrates.
StorageStore product in the unopened container in a dry location. Storage information may be indicated on the product containerlabeling.
Optimal Storage: 8 °C to 21 °C. Storage below 8 °C or greater than 28 °C can adversely affect product properties.
乐泰 3523用于在工业应用中粘合，密封或涂覆金属和玻璃部件。
该产品适用于加强柔性PCB和粘合各种材料。
固化时，具有优异的弹性和韧性，使其具有高抗振动和冲击力。
固化材料的典型特性25°C 1.06
折射率ASTM D 1218 1.48闪点 - 见MSDSViscosity，Brookfield - RVF，25°C，mPa•s（cP）：主轴6，速度20 rpm 16,000至24,000当暴露于365nm的紫外线辐射时，固化性能实验室3523固化。
为了在暴露于空气的表面上获得完全固 |
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