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乐泰®315™ is a self-shimming thermally conductive, one part adhesive for bonding electrical components to heat sinks with an insulating gap.
The high thermal conductivity provides excellent heat dissipation for thermally sensitive components, while the controlled strength permits field and service repair.
The self-shimming property produces a consistent 5-6 mil gap between the component and the heat sink.
This gap results in electrical insulation while maintaining thermal conductivity.
Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks. In high pot applications this product should be limited to a maximum of 500 volts.
Activator 7387™ is required for proper curing. TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity @ 25 °C 1.66Flash Point - See MSDS Viscosity, Brookfield - HBT, 25 °C, mPa•s (cP):Spindle TF, speed 20 rpm, Helipad 360,000 to 850,000LMS
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Coefficient of Thermal Expansion, ASTM D 696, K -1 69×10-6Coefficient of Thermal Conductivity, ASTM C177,W/(m•K)0.808Elongation, at break, ISO 527, % 1 Tensile Strength, at break, ISO 527 N/mm2 15.0 (psi) (2,180)Young's
乐泰®315™是一种自我补片导热，一次性粘合剂，用于将电气部件连接到具有绝缘间隙的散热片。
高热导率为热敏元件提供了优异的散热性能，同时受控的强度可以实现现场维修和维修。
自匀整特性在组件和散热片之间产生一致的5-6密耳间隙。
该间隙导致电绝缘，同时保持导热性。典型应用包括接合变压器，晶体管和其他发热电子部件到印刷电路板组件或散热片。
在高锅应用中，产品应限制在*大500伏特。需要7387™的激活剂才能正 |
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