ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/ECCOBOND G909电子组装/工业胶水/电子组装胶水/工业用胶
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ECCOBOND G909 is designed for very high strength structural bonding especially for dissimilar substrates that will be exposed to a wide range of operating temperatures.
TYPICAL PROPERTIES OF UNCURED MATERIAL Specific Gravity 1.15Press Flow, seconds 65Sag Resistance, mm 12.7Shelf Life @ 0 to 4°C (from date of manufacture), months 4.5Flash Point - See MSDSTYPICAL CURING PERFORMANCE Cure Schedule90 minutes @ 100°C or30 minutes @ 120°C or20 minutes @ 150°CPost Cure2 to 4 hours at the highest expected use temperature Cure schedules are "the time at cure temperature to achieve full product cure".
The times does not include the time required tramp-up to cure temperature.
The above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties: Hardness Shore D:@ 25oC 78@ 120oC 35Storage.
Store product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.
Optimal Storage: 4°C.
Storage greater than or below 4°Ccan adversely affect product properties.
ECCOBOND G909设计用于非常高强度的结构粘合，特别适用于将暴露于宽范围工作温度的不同基材。
特殊材料的特性特殊重力1.15压力流量，秒65抗张力，mm 12.7Shelf寿命（0至4°C制造日期），月份4.5闪点 - 参见MSDSTYPICAL CURING PERFORMANCECURE Schedule 120分钟，100°C或30分钟，120°C或20分钟，150°CPost固化2至4小时，*高预期使用温度固化时间表为 |
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