环氧胶 汉高汉高乐泰乐泰 3131
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乐泰 3131
乐泰 3131 dual cure adhesive is designed for use in the assembly of temperature sensitive electronic components. The maximum performance of this material is achieved by exposure to UV light of suffecient intensity, followed by thermal cure.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, HAAKE PK-100, Cone PK 1 2o, mPa·s (cP):
@ 25°C 14,000
Yield Point @ 25 °C, mPa·s (cP) 9,013
Thixotropic Index (2/20 s
-1 ) 1.6
Specific Gravity 1.23
Pot life @ 25 °C, days >14
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended UV Cure
Light Source and Condition:
Medium pressure mercury lamp
UV Wavelength, nm 220 to 260
Light Intensity, mW/cm2 100
UV Tack-Free Time, seconds 1
Recommended Heat Cure
30 minutes @ 60°C
25 minutes @ 70°C
20 minutes @ 80°C
The above cure profile is a guideline recommendation. Cure rate and ultimate depth of cure depend on light intensity, spectral distribution of light source, exposure time and the light transmittance of the substrate.
With all fast cure systems, the minimum required time for cure depends on the rate of heating. Cure rate depends on the mass of the material to be heated and intimate contact with the heat source. Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results.
TYPICAL PROPERTIES OF CURED MATERIAL
Sample cured 5 secs @ 100 mW/cm2 plus 30 min @ 80°C
Physical Properties:
Hardness, Shore D, ASTM D2240 88
Glass Transition Temperature (Tg) by TMA, °C 85
Coefficient of Thermal Expansion :
Alpha 1, cm/cm/oC 49×10-6
Alpha 2, cm/cm/oC 175×10-6
Volume Shrinkage on Cure, % 2.4
Linear Shrinkage on Cure, % 1.3
TYPICAL PERFORMANCE OF CURED MATERIAL
Sample cured 2 secs @ 100 mW/cm2 plus 30min @ 80°C
Lap Shear Strength :
Polycarbonate N/mm2 1.8
(psi) (261)
乐泰3131
乐泰3131双固化胶粘剂是专为使用温度敏感的电子元件组装。这种材料的*大性能是通过 |
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