汉高汉高乐泰乐泰 贴片红胶Chipbond 3629
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乐泰 3629
乐泰 3629 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required. 乐泰 3629 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.35
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
200 to 650LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
1 to 6
LMS
Particle Size, μm <100
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat above 100°C (typically 110 to 140 seconds @ 120 °C or 3 to 5 minutes @ 110 °C). Higher cure temperatures such as 150 °C can be used to shorten cure times. Rate of cure and final strength will depend on the residence time at the cure temperature.
Cure Speed vs. Time, Temperature
The following graph shows the rate of torque strength developed with time at different temperatures. These times are defined from the moment the adhesive reaches cure temperature. In practice, total oven time may be longer to allow for heat up period. Strength is measured on 1206 capacitors @ 22 °C, tested according to IPC SM817, TM-650 Method 2.4.42.
Cured for 5 minutes @ 100 °C
Torque Strength, IPC SM817,TM-650 Method 2.4.42:
C-1206 on bare FR4 board N·mm 30 to 70
(in.oz) (4 to 10)
Cured for 120 seconds @ 110 °C
Push-off Strength:
C-1206 on bare FR4 board N ≥27.5LMS
(lb) (≥6.19)
3629 乐泰
3629 is designed for the接乐泰表面安装器件在印制电路板prior to波焊锡。特别是在低固化温度are required suited以及热敏感元件，应用在短裤和固化时报are required。3629 has been successfully used |
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