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Manufacturers who want a lead-free solder paste that delivers the “best of the best” need look no further than Multicore LF620. With long open and abandon times, a broad process window, excellent humidity resistance, ultra-low voiding, zero hot slump and outstanding long-term reliability in a lead-free, halide-free, no-clean formulation, Multicore LF620 delivers it all. What’s more, this robust solder paste is capable of printing down to 0.4mm pitch QFP and 0.4mm CSP devices, and has outstanding solderability on a wide range of surface finishes including Nickel/Gold, Immersion Tin, Immersion Silver and OSP Copper
汉高’s Multicore LF620 solder paste is designed for applications that require excellent printability at low speeds and high speeds, with “brick-like” print definition requirements. It is ideally suited for high throughput production, where yield consistency on print deposits is key.
Application Advantage
Less waste on production line (paste has extensive abandon time and work-life on the printer)
Increases customer confidence in process control due to solder paste topography consistency when small components are placed Suitability for 0.4mm CSP apertures and above encourages customer to embrace technology advancements
High reliability solder joints: low voiding due to excellent wetting, and minimal hot slump
Extended tack time helps overcome process delays that may occur on production lines.
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