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乐泰 SI 5293 is designed to provide environmental
protection for printed circuit boards and other sensitive
electronic components.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.0
Flash Point - See SDS
Viscosity, Brookfield - RVT, 25 °C, :
Spindle 1, speed 10 rpm 400 to 800LMS
Solids/Non-Volatile Content, % ≥85LMS
TYPICAL CURING PERFORMANCE
乐泰 SI 5293 cures when exposed to UV radiation of 365
nm.
Normal processing conditions will include exposure to sufficient
UV light irradiance to effectively cure the material. Surface
and/or atmospheric moisture will promote the cure of material
in shadowed regions. Although functional strength is
developed almost instantly due to the UV curing nature of
乐泰 SI 5293, increased cure properties are developed
during 72 hours at ambient conditions.
Surface Cure
Tack Free Time, hours:
Cured @ 22 °C / 50±5 % RH 10 to 24LM
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or
greater than 8 °C can adversely affect product properties. 乐泰 SI 5293旨在提供环保
保护印刷电路板等敏感性
电子元器件。
固化材料的典型特性
25°C时的比重1.0
闪点 - 见SDS
粘度，Brookfield - RVT，25°C，
主轴1，转速10转400〜800LMS
固体/非挥发物含量，％≥85LMS
典型的固 |
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