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3874™ is a thermally conductive adhesive. When used with
Activator 7387™, it cures rapidly to form a high strength, high
modulus, thermoset acrylic polymer. Typical applications
include bonding heat sinks to heat dissipating components
such as BGAs in electronics applications. The thixotropic
nature of 3874™ reduces the migration of liquid product after
application to the substrate.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 2.08
Flash Point - See MSDS
Viscosity, Brookfield - HBT, 25 °C, mPa•s (cP):
Spindle TB, speed 0.5 rpm, Helipath 800,000 to 1,800,000LMS
Spindle TB, speed 5 rpm, Helipath 200,000 to 450,000LMS
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The graph
below shows the shear strength developed with time on grit
blasted steel lap shears and tested according to ISO 4587.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or
greater than 8 °C can adversely affect product properties.
3874™是导热胶。与...一起使用
活化剂7387™，它快速固化，形成高强度，高
模量，热固性丙烯酸聚合物。典型应用
包括将散热片连接到散热部件
如电子应用中的BGA。触变性
387 |
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