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ECCOBOND CT4042-1 A/B is a silver-filled, easy to apply, conductive epoxy paste adhesive. It is recommended for chip bonding in microelectronic applications. ECCOBOND CT4042- 1 A/B is the lower viscosity version of ECCOBOND CT4042 adhesive.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Part A Properties CT4042-1A:
Viscosity, mPa•s (cP) 110,000
Density , g/cm3 2.35
Flash Point - See MSDS
Part B Properties CT4042-1B:
Viscosity, mPa•s (cP) 75,000
Density , g/cm3 3.4
Flash Point - See MSDS
Mixed Properties :
Pot life @ 25 °C, 20gram mixture, days 4
Shelf Life @ 18 to 25°C (from date of manufacture), year 1
TYPICAL CURING PERFORMANCE
Cure Schedule
120minutes @ 80°C
30minutes @ 120°C
15minutes @ 150°C
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
eccobond ct4042-1 A / B是一个银填充，易于应用，环氧导电胶粘剂。建议在微电子应用芯片粘接。eccobond ct4042 - 1 A / B是eccobond ct4042胶粘剂粘度较低版本。
固化材料的典型性能
部分的性能ct4042-1a：
粘度，兆帕S（CP）110000
密度，克/厘米2.353
闪光点看到MSDS
B部分性能ct4042-1b：
粘度，兆帕S（CP）75000
密度，克/厘米3.43
闪光点看到MSDS
混合性能：
锅生活@ 25°C，20gram混合物，4天
保质期@ 18至25°C（从制造日期），第1年
典型的固化性能
治疗计划
120minutes @ 80°C
30minutes @ 120°C
15minutes @ 150°C
上述固化型材指南建议。固化条件（时间和温度）可能会根据客户的经验和他们的应用要求，以及客户固化设备，烘箱负荷和实际烤箱温度变化。 |
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