汉高汉高乐泰乐泰 贴片红胶Chipbond 3626
技术服务热线：021-51693135 / 021-22818476
乐泰 3626
乐泰 3626M is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. This material is formulated to give excellent dot size and shape control when applied with a stencil using hand print or machine print process. 乐泰 3626M is halogen free and offers a very high thermal mechanical strength even at temperatures as high as 260oC.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.4
Density, g/cm3 1.3
Flash Point - See SDS
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
Casson model @ 0.4 - 30 s
-1
190 to 250LMS
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat above 100oC, (minimum 120 seconds at 130°C or 90 secs at 150°C at the bondline). Rate of cure and final strength will depend on PCB type and population, ramp up temperature, stability of the component temperature and residence time at temperature.
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 30 minutes @ 150 °C
Physical Properties
Coefficient of Thermal Expansion,
ASTM D696, K-1:
Below Tg, μm/moC 48
Above Tg, μm/moC 184
Glass Transition Temperature (Tg), °C 138
TYPICAL PERFORMANCE OF CURED MATERIAL
Shear Strength
Shear Strength, ISO 4587, ASTM D1002, Sample cured 30 minutes
@ 150°C:
Grit Blasted Mild Steel N/mm2 18
(psi) (2,610)
Push Strength, per IPC SM817, Sample cured 5
minutes @ 125°C
TYPICAL ENVIRONMENTAL RESISTANCE
Cured for 30 minutes @ 150 °C
Lap Shear Strength, ISO 4587:
Mild steel (grit blasted)
乐泰3626
乐泰3626m设计用于粘接的表面贴装设备的印刷电路板波峰焊接之前。这种材料的配方，以提供良好的点大小和形状控制时，用模板使用手工打印或机器打印过程。乐泰3626m是无卤、甚至在温度为260oC.高提供了一个很高的热机械强度
固化材料的典型性能
比重@ 25°C 1.4
密度，克/厘米1.33
闪点-见SDS
屈服点，25°C，PA
锥板流变仪：
哈克PK 100，M10 / PK 1 2°锥
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