Gap Pad 2000S40乐泰胶水,电子胶水
技术服务热线:021-51693135 / 021-22818476
高度一致的导热,增强型“S级”间隙填充材料间隙垫2000S40推荐用于要求中高热导性界面材料的低应力应用。该材料的高度适应性允许垫填充气隙和 PC板和散热片之间的空气间隙或具有阶梯形状,粗糙表面和高堆叠公差的金属底盘。 Gap Pad 2000S40在材料两侧提供固有的天然粘合性,可在应用组装过程中产生就地特性。材料两侧均配有保护衬垫。顶部具有较小的粘性,易于处理。
特点:热导率:2.0 W / m-K.低压“S级”耐热性。高度适应性,低硬度。适用于低应力应用。玻璃纤维增强了刺穿,抗剪切和抗撕裂
Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Materia Gap Pad 2000S40 is recommended for lowstress applications that require a mid to high thermally conductive interface material.The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. Gap Pad 2000S40 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly.The material is supplied with protective liners on both sides.The top side has reduced tack for ease of handling.
Features.Thermal conductivity: 2.0 W/m-K.Low “S-Class” thermal resistance at very low pressures.Highly conformable, low hardness.Designed for low-stress applications.Fiberglass reinforced for puncture, shear and tear resistanc |
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