Gap Filler 3500S35 乐泰胶水,电子胶水
技术服务热线:021-51693135 / 021-22818476
导热液体间隙填充材料间隙填料3500S35是导热,液隙填充材料的技术领先者,具有超高的热性能和优异的柔软性。材料是双组分的,在室温或高温下固化。在固化之前,该材料保持良好的触变特性以及低粘度。结果是凝胶状液体材料被设计成填充气隙和空隙,但是当通过外力(例如分配或组装过程)作用时仍然流动。材料是与通用散热器或外壳具有高地形和/或堆叠公差的易碎部件接口的极好解决方案。一旦固化,它仍然是一种低弹性模量弹性体,旨在帮助缓解热循环过程中的CTE应力,同时保持足够的模量以防止从界面泵出。间隙填料3500S35将轻轻地粘附在表面上,从而改善表面积接触。间隙填料3500S35不是设计成结构粘合剂。
Thermally Conductive Liquid Gap Filling Materia Gap Filler 3500S35 is the technology leader in thermally conductive, liquid gap filling materials, featuring ultra-high thermal performance and superior softness.The material is twocomponent,cured either at room or elevated temperature. Prior to curing, the material maintains good thixotropic characteristics as well as low viscosity.The result is a gel-like liquid material designed to fill air gaps and voids yet flow when acted upon by an external force (e.g. dispensing or assembly process).The material is an excellent solution for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. Once cured, it remains a low modulus elastomer designed to assist in relieving CTE stresses during thermal cycling yet maintain enough modulus to prevent pump-out from the interface. Gap Filler 3500S35 will lightly adhere to surfaces, thus improving surface area contact. Gap Filler 3500S35 is not designed to be a structural adhesive |
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