ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/ECCOBOND XCE3111电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
乐泰 ABLESTIK XCE 3111 one component adhesive isdesigned for die strap to antenna attach of RFID inlayapplications. It is suitable for reel-to-reel production lines andhigh speed jetting or printing applications and allowsexceptional fine pitch resolution.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield - Cone & Plate, 25 °C, mPa•s (cP):
Plate 4cm @ Shear rate 30 s
-1 18,000
Shear Thinning Index 5.1
Pot life , days 2
Shelf Life @ -40°C, days 183
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Cure Schedule
10 seconds @ 110°C at bondline
The cure speed of the product will depend on the efficiency andeffectiveness of the heat transfer method used to cure the adhesive.
The product can also be cured in a convenction oven for longer time.Material properties, however, will depend on the cure condition used.
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures.
Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage : -40 °C
乐泰 ABLESTIK XCE 3111单组分胶粘剂设计用于芯片贴带与RFID嵌体的天线连接应用程序。适用于卷轴到卷轴生产线和高速喷射或打印应用和允许特殊的细间距分辨率。
固化材料的典型特性
粘度，布鲁克菲尔德 - 孔和板， |
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