ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/ECCOBOND CE3126电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
CE-3126 snap curable anisotropic adhesive is especially suitedin applications where throughput is critical. This product istypically used for very fine pitch flip chip interconnectionswhere electrical conductivity is desired in only one direction.
This material can be spot cured at temperatures as low as 170°C, making it ideal for use with temperature sensitivesubstrates and components.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity at 15 S-1
Rheometer
16,300
Work Life, days 2
Shelf Life @ -40°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
8 seconds @ 170°C
The recommended cure conditions for CE-3126 depend on thebondline temperature used. When the bondline temperature israised to 170°C, 8 seconds are sufficient to cure theadhesive. The pressure needed during cure is strongly relatedto the exact deisgn set-up. The optimum pressure is bestdetermined for each new design.
Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -40 °C
CE-3126可固化各向异性粘合剂特别适合在吞吐量至关重要的应用中。这个产品是通常用于非常细的间距倒装芯片互连其中仅在一个方向上需要导电性。该材料可以在低至170℃的温度下点固化°C，使其成为温度敏感的理想选择基板和部件。
固化材料的典型特性
粘度在15 S-1
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