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乐泰 ABLESTIK 2025D die attach adhesive is designed for use inarray packaging.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Thixotropic Index (0.5/5 rpm) 4.4
Viscosity, Brookfield CP51, 25 °C, mPa•s (cP):
Speed 5 rpm 11,500
Work Life by Gel Time, hours:
@ 25oC, 30cc syringe 16
@ 25oC, 10cc syringe 24
Shelf Life @ -40°C (from date of manufacture), days 365
TYPICAL CURING PERFORMANCE
Cure Schedule
30 minute ramp to 175°C + 15 minutes @ 175°C
Weight Loss on Cure
10 x 10 mm Si die on glass slide, % 2.5
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based on customers'experience and their application requirements, as well as customercuring equipment, oven loading and actual oven temperatures
Storage
Store product in the unopened container in a dry location. Storageinformation may be indicated on the product container labeling.Optimal Storage: -40 °C. Storage below minus (-)40 °C or greaterthan minus (-)40 °C can adversely affect product properties.
乐泰 ABLESTIK 2025D贴片粘合剂设计用于阵列包装。固化材料的典型特性
触变指数（0.5 / 5 rpm）4.4
粘度，Brookfield CP51,25℃，mPa•s（cP）：
转速5 rpm 11,500
工作时间凝胶时间，小时：
@25oC，30cc注射器16
@25oC，10cc注射器24
保质期@ -40°C（制造日期），第365天
典型的固化性能
治愈时间表
在175℃下升温至175℃+15分钟
治愈减肥
10 x 10 mm Si玻片上的模具，％2.5以 |
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