ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/ECCOBOND G500HF电子组装/工业胶水/电子组装胶水/工业用胶
技术服务热线：021-51693135 / 021-22818476
乐泰 ABLESTIK G 500HF is a general purpose epoxy adhesive and sealant that cures to a high gloss finish.
TYPICAL PROPERTIES OF UNCURED MATERIAL Density, g/cm3 1.45Sag Resistance, mils 600 to 900 Press Flow, seconds 30 to 60Shelf Life @ 25°C, months 3Flash Point - See SDSTYPICAL CURING PERFORMANCE Cure Schedule60 minutes @ 125°C or20 minutes @ 150°C or5 minutes @ 175°C For optimum performance, follow the initial cure with a post cure of 2 to4 hours at the highest expected use temperature.
The above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product containerlabeling.Optimal Storage: 25°C.
Storage greater than or below 25°C can adversely affect product properties.
乐泰 ABLESTIK G 500HF是一种通用的环氧树脂胶粘剂和密封剂，可以固化成高光泽度。
固化材料的特性密度，g /cm31.45耐压，密耳600至900按流量，秒30至60秒25°C以下的寿命，3个闪点 - 见125℃或150分钟或175℃下5分钟的125℃或20分钟的静态固化性能表为了获得*佳性能，请在*高预期使用温度下进行固化2至4小时的初始固化。
以上治疗方案是准则建议。
保养条件（时间和温度）可能会根据客户的经验和应用要求以及定制设备，烤箱装载和实际烤箱温度而有所不同。
存储在未打开的容器中的产品在干燥的位置。
存储信息可能在产品上显示容器标签。
*佳储存：25°C。超过或低于25° |
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