汉高汉高乐泰乐泰 贴片红胶Chipbond 3611
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乐泰 3611
乐泰 3611 is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where very fast cure is required on high speed SMT lines. The very low moisture absorption allows longer exposure to humidity in open baths, without affecting dispensability or causing void formation in the cured adhesive.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.3
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
125 to 400LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
20 to 50
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat above 100 °C (typically 90-120 seconds @ 150 °C). Rate of cure and final strength will depend on the residence time at the cure temperature.
Cure Speed vs. Time, Temperature
The following graph shows the rate of torque strength eveloped with time at different temperatures. These times are defined from the moment the adhesive reaches cure temperature. In practice, total oven time may be longer to allow for heat up period. Strength is measured on 1206 capacitors @ 22 °C, tested according to IPC SM817, TM-650 Method 2.4.42.
乐泰 3611
乐泰 3611是表面安装器件接designed for prior to to印制电路板波焊锡。特别是，很快治愈suited是需要高速贴片线。在非常低的吸湿allows longer exposure to湿度在开放浴池，不影响dispensability金造成无效训练in the固化胶粘剂。
uncured材料的典型性能
比重：25℃1.3
屈服点，25℃，PA
平锥与血流计：
Haake PK 100，M10 / PK 1 2°锥
400lms 125 to
卡森粘度”25°C，pa∙s
平锥与血流计：
Haake PK 100，M10 / PK 1 2°锥
20至50
See SDS闪光点
典型的固化性能
推荐固化are exposure to热条件（通常在100℃90-120二@ 150°C）。*终会治愈率和强度取决于我们住宅time at the固化温度。
康复速度和时间，温度
以下图表显示the rate of扭矩强度发展与时间在不同的温度。 |
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